Discussion about this post

User's avatar
offline's avatar

This whole batch of updates is starting to show a clear pattern: AI isn’t just pushing performance curves — it’s reshaping the entire semiconductor system stack. Labor (Samsung), materials (SiC at Wolfspeed), networking (MRC + DPUs), and even the historical narratives we use to understand risk (Trilogy) are all being pulled into the same gravitational field.

What’s wild is how each layer is reacting differently:

• memory fabs are hitting labor‑leverage limits

• power materials are getting a second life

• networking is shifting from fabric‑centric to DPU‑centric

• wafer‑scale ambition still lives in the shadow of Trilogy’s curse

Feels like we’re watching the industry reorganize itself in real time — not around chips, but around AI‑driven constraints.

Eleven Dots's avatar

I love the TIL sections. Great work, guys!

1 more comment...

No posts

Ready for more?